Journal Articles

  1. R Kou, Y Zhong*, Y Qiao*, Effects of anion size on flow electrification of polycarbonate and polyethylene terephthalate, Applied Physics Letters, 2019, 115, 073704. 

  2. Y Zhong, R Kou (co-first-author), M Wang, Y Qiao*, Electrification Mechanism of Corona Charged Organic Electrets. Journal of Physics D: Applied Physics, 2019, 52, 44.

  3. Y Zhong, R An, H Ma, C Wang*. Low-temperature-solderable intermetallic nanoparticles for 3D printable flexible electronics. Acta Materialia, 2019, 162: 163-175.

  4. Y Zhong*, R Kou, M Wang, Y Qiao. Synthesis of large-scale monolithic silicon carbide with well-defined nanopores and size effect of mechanical properties. Journal of the European Ceramic Society, 2019, 39 (7): 2566-2573.

  5. R Kou, Y Zhong (co-first-author), J Kim, M Wang, Q Wang, R Chen, Y Qiao*. Elevating low-emissivity films for lower U-value. Energy and Buildings, 2019, 193: 69-77.

  6. H Su, T Chen, R Kou, M Wang, Y Zhong, Y Qiao, Y Hong*. Fatigue Behavior of Inorganic-Organic Hybrid “Lunar Cement”, Scientific Reports, 2019, 9, 2238.

  7. T Chen, B Chow, Y Zhong, M Wang, R Kou, Y Qiao*. Formation of polymer micro-agglomerations in ultralow-binder-content composite based on lunar soil simulant. Advances in Space Research, 2018, 61 (3), 830-836.

  8. M Wang, L Zhu, A Le, D Noelle, Y Shi, Y Zhong, F Hao, X Chen, Y Qiao*. A multifunctional battery module design for electric vehicle. Journal of Modern Transportation, 2017, 25 (4): 218-222.

  9. Y Zhong, F Zhang, M Wang, G Calvin, G Kim, Y Liu, J Leng, S Jin, R Chen*. Reversible humidity sensitive clothing for personalized thermoregulation. Scientific Reports, 2017, 7: 44208.

  10. B Chow, T Chen, Y Zhong, Y Qiao*. Direct formation of structural components using a Martian soil simulant. Scientific Reports, 2017, 7(1).

  11. C Zhao, Y Zhong, Y Qiao*. Effects of porosity on dynamic indentation resistance of silica nanofoam, Scientific Reports, 2017, 7(1): 1060.

  12. B Chow, T Chen, Y Zhong, M Wang, Y Qiao*. Compaction of montmorillonite in ultra-dry state. Advances in Space Research, 2017, 60 (7), 1443-1452.

  13. T Chen, B Chow, M Wang, Y Zhong, Y Qiao*. High-pressure densification of composite Lunar cement. Journal of Materials in Civil Engineering, 2017, 29 (10), 06017013.

  14. Y Zhong, W Liu, C Wang*, X Zhao, J Caers. The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling. Materials Science and Engineering: A, 2016, 652: 264-270.

  15. Y Zhong, R An, C Wang*, Z Zheng, Z Liu, C Liu, C Li, T Kim, S Jin. Low temperature sintering Cu6Sn5 nanoparticles for superplastic and super-uniform high temperature circuit interconnections. Small, 2015, 11(33), 4097-4103.

  16. Y Zhong, W Zhang, C Wang*, B Li. Manufacturing and microstructure of Cu coated diamonds/SnAgCu composite solder bumps. Applied Mechanics and Materials, 2013, 288: 323-327.

  17. W Zhang, Y Zhong, C Wang*. Effect of diamond additions on wettability and distribution of SnAgCu composite solder. Journal of Materials Science and Technology, 2012, 28(7): 661-665.

  18. B Li, C Wang, Liu W, Y Zhong. Synthesis of Co-doped barium strontium titanite nanofibers by sol-gel/electrospinning process. Materials Letters, 2012, 75: 207-210.

Conference Papers

  1. Y Zhong, C Wang, X Zhao, J Caers. The influence of high melting point elements on the reliability of solder during thermal shock. The 65th Electronic Components and Technology Conference, 2015: 2162-2167.

  2. Y Zhong, C Wang, J Caers, X Zhao. The evolution of IMCs' morphologies and types in SAC and SAC+ solder bumps during thermal shock process. The 14th Electronic Materials and Packaging, 2012: 1-4.

  3. Y Zhong, W Zhang, C Wang, B Li. Preparation and microstructure of functionally gradient diamond/SAC composite solder bumps. The 12th Electronic Packaging Technology and High Density Packaging, 2011: 1-5. (Best Paper Award)

  4. C Wang, Y Zhong, Caers J, X Zhao, B Li, B Liu. Relationship between crack propagation trends and grains in SnAgCu interconnects. The 13th Electronic Packaging Technology and High Density Packaging, 2012: 1200-1204.

  5. B Li, C Wang, W Liu, Y Zhong, Z Zhang. Synthesis of multiferroic Ba0.7Sr0.3TiO3-based thin films for memory devices by chemical solution deposition. The 13th Electronic Packaging Technology and High Density Packaging, 2012: 12-14.

  6. X Zhao, J Caers, S Noijen, Y Zhong, D Jong, H Gijsbers, G Elger, H Willwohl. Potential interconnect technologies for high power LEDs assemblies. The 4th Electronic System-Integration Technology Conference, 2012: 1-4. (Best Paper Award)